BitSummit 'High' to Be Held in Kyoto in May 2027

BitSummit 2027 'Reaching New Heights' to Be Held in Kyoto Next May

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비트서밋 2027 '새로운 높이를 향해', 내년 5월 교토서 개최
©BitSummit

The BitSummit Executive Committee and the Japan Independent Games Association (JIGA) announced that BitSummit High will be held for three days from May 21 to 23, 2027, at Miyako Messe (Kyoto Industrial Exhibition Hall) in Kyoto. Applications for sponsors and corporate exhibitors have also opened.

The 2027 event will mark the 15th iteration of BitSummit. According to the organizers, attendance exceeded 68,000 visitors in 2026. The first day of the event, May 21, 2027, will operate as a Business Day restricted to industry professionals, while the general public days will be May 22 and 23.

The theme for this edition is "High," signifying reaching new heights. The organizers incorporated into the theme the challenge of taking on new heights and the exhilarating feeling of excitement. The event aims to be a venue where developers and players discover games, enjoy them, and share their passion. Overview details and application instructions for corporate exhibitors are provided on the official BitSummit website.

A partner has also been designated to support travel and accommodation for event participants. The organizers signed an official travel partner contract with HIS. This marks the first time HIS will serve as BitSummit's official travel partner. Both parties plan to assist domestic and international exhibitors, sponsors, and visitors with travel and lodging to create a seamless event environment.

BitSummit was launched in late 2012 with the goal of raising awareness of Japanese indie games overseas. The inaugural event in 2013, held for industry professionals, drew approximately 200 attendees. Since then, it has continued as an annual indie game event held in Kyoto.

Originally written in Korean, this article was translated with AI assistance and edited by a native English-speaking editor. Every translation is reviewed by our editorial team before publication. [Read Original]